GMIF2026 Exhibition Recap: Innovation Across the AI Memory & Storage Chain on Show

SHENZHEN, China, Oct. 23, 2026 /PRNewswire/ — The 5th GMIF Innovation Summit (Global Memory Innovation Forum 2026, GMIF2026), co-hosted by the Shenzhen Memory Industry Association (SMIA) and the School of Integrated Circuits at Peking University, recently concluded at the Renaissance Shenzhen Bay Hotel, with the theme of "The Future Built on AI Memory and Storage." As a global annual gathering in memory and storage industry chain, the concurrent exhibition brought together 40 companies across the value chain, each presenting products and solutions that show where memory and storage technology, industry trends, and applications are heading in the AI era.

Sandisk, a global leading provider in NAND flash solutions, focuses on its innovations in industrial, automotive and enterprise-grade sectors. Its iNAND AT EU752 automotive UFS 4.1 embedded flash is built on the latest 218-layer BiCS8 3D NAND, supporting wide-temperature operations ranging from -40°C to 105°C and certified with AEC-Q100. Underpinned by the SmartSLC technology, it achieves 2.8x faster in read and 2.5x in write compared with the previous UFS 3.1. For the enterprise sector, Sandisk showcased its SN861 NVMe drive, which delivers high read throughput up to 13700 MB/s and is equipped with Flexible Data Placement (FDP) to reduce write amplification and extend lifespan. It also displayed the BiCS8 enterprise-grade QLC NAND with capacity up to 8TB per package, tailored for AI data storage and data lakes.

Silicon Motion, a global leader in NAND flash controller design, presented a full-stack controller portfolio for AI factories (data centers), edge AI (terminal devices), and physical AI (automotive and embodied intelligence). Its next-generation flagship SM8466, built on TSMC’s 4nm process for PCIe Gen6 enterprise platforms, delivers 28GB/s sequential read and 7M random read IOPS, supports the SCA interface and E3.S form factor, and can address single drives of 512TB and above. It integrates an ARM Cortex-R82 core, uses CoCo 16K LDPC ECC to strengthen enterprise QLC endurance, and includes a Caliptra 2.1 root of trust supporting post-quantum cryptography (PQC).

Lenovo advances its hybrid AI strategy with full-stack AI infrastructure spanning devices, edge, cloud, and network. It exhibited its WenTian AI training and inference integrated servers: the flagship WA5480 G3, with a 4U rack supporting up to 10 double-wide GPUs and 32 DDR5 DIMMs, and the WR5220 G5 and WR5225 G3, powered by the latest Intel Xeon 6 and AMD EPYC processors.

BIWIN showcased a storage portfolio spanning cloud, edge, and on-device AI. Its integrated R&D, packaging, and testing capability brings IC design, manufacturing, and packaging and testing resources together, with flexible customization of firmware algorithms, hardware parameters, and packaging options, delivering higher-value storage solutions that fit each application more closely.

• Embedded storage: eMMC, UFS, LPDDR, eMCP, uMCP, ePoP, and BGA SSD, built on in-house controllers, in-house LDPC error correction, and low-power technology, for emerging on-device AI applications such as smartphones, AI/AR glasses, smartwatches, AI learning devices, and embodied AI.
• Industrial and automotive-grade storage: a full lineup spanning SSDs, memory modules, memory cards, embedded products, BGA SSDs, and NOR Flash, with temperature coverage as wide as -40°C to 105°C for reliable storage in harsh environments.
• Enterprise storage: SATA SSDs, PCIe SSDs, CXL, and DDR5 RDIMM, combining high performance, reliability, and endurance for AI data centers and servers.
• PC OEM storage: PC OEM SSDs and PC OEM memory.

Numbers Law built its PMD (Parallel Magnetic Drive), a next-generation high-capacity AI hard drive, on its in-house M3 architecture. The company says PMD delivers 21x the bandwidth and more than 1,000x the random IOPS of conventional HDDs. The supply chain is domestic from R&D and testing through volume production, with a high level of localization in core components and national cryptographic compliance, offering AI data centers and big data clusters a high price-performance path for AI HDDs in China.

NEXWISE is building a full-stack infrastructure system around "AI plus cloud computing" and "AI plus security." Its subsidiary KuberCloud showcased an intelligent compute platform and its token factory. Backed by large-scale compute clusters across China, the KuberCloud platform manages heterogeneous compute and uses vGPU pooling to raise utilization to 70% or more. A unified token entry point turns compute into a pay-per-use service, and the company has delivered more than 20 benchmark projects for government and enterprise customers.

Paratera has bridged the architectural gap between supercomputing and AI computing with its nearly two decades of experience in compute services. Its in-house "Paratera Compute Network" and cross-cluster intelligent scheduling system orchestrate heterogeneous compute across millions of CPU cores and tens of thousands of GPUs, lifting utilization above 85%. Through its MaaS platform and an innovative "token factory" business model, the company supports large model training, inference, and AI for Science.

OKN Technology has built full-stack, in-house hardware and software capabilities in memory testing. It was first to release a PCIe Gen 6 eSSD test system and a next-generation high-speed DDR5 test system, and brought its GA300 series SSD test system to the exhibition. On the hardware side, the system supports high-precision, low-power current measurement and automatic thermal chamber control. On the software side, it offers independent slot control and open-source scripts. Test coverage includes power-loss protection, RDT/MTBF, four-corner testing, and read disturb, and the fully domestic platform helps safeguard memory yield.

Infplane, an innovator in AI Native storage architecture, is reshaping the data path for on-device AI. The AI SSD solution on display uses a dedicated acceleration partition and custom scheduling algorithms to enable KV cache persistence, hot/cold expert prefetching for MoE models, and intelligent tiering of model data. By using NAND to supplement limited DRAM/VRAM, it lets thin-and-light laptops and workstations run models with at least 2x more parameters, while cutting time to first token (TTFT) by 90%–95%, and bringing smooth local inference of 100B+ parameter models to consumer devices.

Genstoraige is executing a full-stack, in-house strategy spanning "storage + connectivity + solutions" to build AI storage acceleration across cloud, edge, and device. The highlight on display is the Edge AI90 Inference Token Factory, which pioneers an FaaS for KV Cache Offload architecture. It dynamically offloads KV cache to AI SSDs and orchestrates a three-tier HBM + DRAM + SCM hierarchy, expanding effective memory to the TB level. This enables edge deployment of models with 100B+ parameters, delivers 10x higher token throughput, and, in testing, cuts inference cost to 1/67 of the cloud. Paired with the in-house PT200Z AI SSD at 14.8 GB/s, the solution delivers a decisive performance breakthrough.

Maxio Technology, which serves more than 100 leading industry customers, showed a full lineup of SSD controllers spanning PCIe Gen5, Gen4, UFS, and eMMC.

• MAP1808/MAP1802: flagship PCIe Gen5x4 controllers with read/write speeds of up to 14,800/14,200MB/s.
• MAP1803: an enterprise controller supporting 16CH×8CE, with read and write speeds of up to 14,400MB/s.
• MAU3602: an embedded UFS 4.1 controller with read/write speeds of up to 4,200MB/s.

The full line supports 4K LDPC error correction, reflecting Maxio’s expertise across the "sensing, transmission, and storage" chain and its work with the wider ecosystem.

Attach Point focuses on high-end advanced packaging equipment, including wafer-level thermocompression bonding (TCB) and hybrid bonding (HB). It has achieved a domestic breakthrough in wafer-level 2.5D/3D bonding equipment, ending a long-standing international monopoly. On site, the company featured its AP-SMART INLINE intelligent packaging line, which offers ±7μm XY placement accuracy, automotive-grade process control with a Cpk above 1.67, and a capacity gain of more than 20%. It also showed the VULCAN PRO series of thermocompression bonders for HBM and ultra-thin stacking.

Topdisk, with years of focus on NAND Flash, showed a full range of high-performance storage products. Its flagship M.2 PCIe Gen5 SSD, equipped with a DRAM cache, reaches read/write speeds of up to 14,000/13,000MB/s. The Extreme series microSD cards offer 240MB/s read speeds for 4K/8K and high-frequency security capture, and a complete lineup of PCIe Gen4, Gen3, and mSATA products rounds out the range, showing strong scenario fit and global delivery capability.

KingSpec exhibited with its five sub-brands, KingSpec, YANSEN, ONEBOOM, MemoStone, and MIXAGE, along with its one-stop storage solutions. The highlight was its in-house ZD102 memory module tester, which runs 60 DDR4 UDIMMs in parallel per batch, pinpoints faults at the chip (DRAM) level, and monitors tests visually in real time. Its industrial-grade storage lineup has passed -40°C to +85°C wide-temperature testing and integrates power-loss protection, AES-256 hardware encryption, and other core technologies, providing stable support for large-scale memory manufacturing and smart manufacturing.

POWEV serves consumer gaming, the mass market, and industry applications through its three brands, Gloway, Asgard, and SINKER. Drawing on nearly 200 intellectual property rights, it showed industrial-grade PCIe and SATA SSDs that support a -40°C to 85°C temperature range and power-loss protection, enterprise DDR4/DDR5 memory modules built for stable 24/7 operation, and high-performance gaming modules from the SINKER series, setting a benchmark for domestic memory brands.

Quanxing Technology introduced its Tianyi AI SSD, a fusion solution that extends GPU memory. Using the in-house AILink Plus algorithm, one drive does double duty: it works as a high-performance PCIe 5.0 SSD and as an external GPU memory pool, with hot/cold scheduling across GPU memory, system memory, and SSD to support KV cache reuse and MoE parameter offloading. Mini PCs and laptops can run 100B+ MoE models locally, with inference cost cut by up to 90% and concurrency performance up 50%.

COMIX, as a member of the Shenzhen Memory Industry Association, has close business ties to the memory industry. Its online mall carries a broad range of memory products, including USB drives, portable hard drives, SSDs, memory modules, and memory cards, in a full range of specifications to meet bulk purchasing needs. Drawing on its strengths in general industrial supplies procurement and government and enterprise services, COMIX also serves the diverse purchasing needs of memory and semiconductor companies.

Barycn focuses on R&D across the memory chip value chain and showed a full lineup of memory products, from LPDDR3 to LPDDR5/5X (up to 8,533Mbps) and DDR4. Backed by long-standing partnerships with international and domestic IDMs and its own wafer-level (INKDIE) test factory, it gives customers worldwide a reliable, fast-responding memory supply chain.

LKAUTO showed three product lines: precision ball placement, automated optical inspection (AOI), and packaging and testing peripherals. They include the WSP1000 fully automatic wafer ball placement machine, the AP500 substrate ball placement machine, and the DW10 wafer appearance AOI inspection machine. Built on micron-level ball placement and 2D/3D vision technology, the company’s equipment represents the advanced level of domestic semiconductor packaging and test equipment.

Maxwell Technologies (Zhuhai), focuses on high-end memory and co-packaged optics (CPO). It showed full-process line solutions for semiconductor manufacturing covering wafer grinding and polishing, femtosecond laser surface dicing, plasma dicing, and hybrid bonding (D2W/W2W). Its integrated grinding-polishing and laser dicing equipment has been adopted across leading domestic OSATs, covering 8-inch and 12-inch memory and HBM production and helping cut costs and raise efficiency across the value chain.

Silergy, drawing on more than 1,900 patent grants and its in-house semiconductor processes, showed a portfolio of efficient, highly integrated power management ICs (PMICs) for memory. They include the highly integrated SY70202A/K for SSDs, the SY72025N backup power PMIC, the SY70501 for LPDDR5/5X, and the SQ40203C for DDR5, giving memory devices green, reliable power management for stable operation under demanding conditions.

Heyan Technology exhibited a complete solution for precision grinding and dicing. It includes the YWT/YDT series of fully automatic tape mounting and peeling machines, the WM series of vacuum tape mounters, and the C3000 wafer cleaner. Backed by more than 100 core patents, the company targets the challenge of processing ultra-thin wafers in 3D advanced packaging and HBM stacking.

ExTripod Electronics showed the FlexTRAK-CD/CDS high-throughput plasma treatment system and the Sigma bond tester. The plasma system is designed to decontaminate and roughen surfaces before die attach, wire bonding, and underfill, significantly improving mold compound and die attach adhesion and eliminating voids, a high-value solution for raising packaging and testing yield.

Hemei Jingyi is one of the few domestic manufacturers with full, self-controlled mass-production technology for IC package substrates. It brought a complete range of substrates for DRAM and NAND Flash, including 6-to-8-layer high-density interconnect (HDI) boards and substrates for UFS, LPDDR4X, ePoP, and WBGA packages, demonstrating strong volume-production capability for high-density package substrates.

YEESTOR‘s technology rests on three pillars: storage control, compute-storage interconnect, and compute-in-memory. At the exhibition, the company showed its flagship YS9503, a PCIe Gen5x4 NVMe 2.0 controller that delivers sequential read/write speeds of 14.8/14.3 GB/s and more than 3,000,000 random IOPS, with support for China’s national cryptographic standards and end-to-end data protection. It also exhibited a full range of industrial-grade M.2 PCIe SSD, eMMC 5.1, and UFS 3.1 controllers, covering AI phones, AI PCs, AIoT, and AI infrastructure.

MICROVIEW, founded in 2019, develops and manufactures high-precision packaging equipment on fully in-house core technology, led by a team with more than 20 years of experience in the field. It highlighted the MV-M50-Plus die bonder for 3D ultra-thin die stacking, with placement accuracy of up to ±5μm, built for FBGA and WBGA memory packaging. The machine supports 12-inch wafer expansion and stacking of up to 16 ultra-thin layers, combining high precision with flexible process capability.

Suntak Technology exhibited a 5-order HDI AI DDR board, the KUNLUN 232G GPU card, and a 28-layer AI server OAM board. The OAM board uses high-grade materials such as EM-890K and achieves an aspect ratio of 17.5:1, with resin plugging and POFV (plating over filled via) processes and tight control of high-frequency, high-speed impedance, meeting the demanding signal transmission requirements of extreme AI compute hardware.

HIKSEMI showed a full-stack product line from the data center to intelligent connected vehicles. For AI compute, it exhibited the R1 DDR5 RDIMM server memory, with optimized signaling and parity, and the D300 enterprise SSD, with in-house power-loss protection. For smart mobility, it showed its AEC-Q100-certified automotive-grade eMMC 5.1 series, demonstrating its system-level validation and firmware development capabilities.

Jielong Storage, founded in 2017 and headquartered in Shenzhen, offers a full range of memory products under its own Caplink brand, including SSDs, memory modules, eMMC, USB drives, and memory cards. At the summit, it showcased a lineup spanning DDR3, DDR4, and DDR5 modules, 7,000MB/s PCIe Gen4x4 SSDs, eMMC, and portable SSDs. Its manufacturing chain covers wafer testing, finished-product packaging, and assembly, enabling one-stop customization for customers worldwide.

Zhongzhi Testing, founded in 2005 and based in Shatian, Dongguan, is a leading maker of environmental simulation and reliability test equipment, recognized as a national high-tech enterprise and a Guangdong "specialized, refined, distinctive, and innovative" company. It showed an SSD BIT lineup, including HAST chambers, PCIe-channel high/low temperature burn-in cabinets, and rapid-change chambers with up to 20°C/min ramp rates, built on CFD simulation and intelligent algorithms.

Xinyu Technology is a leader in green remanufacturing and automated testing of memory chips. The company led the development of the MIIT industry standard Management Specification for the Reuse and Remanufacturing of Electronic Component, and has built a complete process covering irrecoverable data erasure, ball placement, testing, and lifespan prediction. It also champions inclusive employment, with people with disabilities making up about 40% of its workforce, creating a sustainable, circular model for green memory.

Yuda Electronics sells consumer and automotive-grade memory chips from its own warehouse in Hong Kong, with annual revenue above 1.5 billion. Through diverse global sourcing channels, it provides product solutions, technical support, and cross-border warehousing and logistics.

Acroview Technology is committed to developing innovative semiconductor test solutions, such as SLT and BI testers for AI SoCs, high-reliability power modules, DDR, LPDDR, HBM, UFS, eMMC, NAND, and SSD. At the summit, it highlighted the V9000 series, which it describes as the world’s first stacked high-capacity test system, including the A8100T tri-temperature handler and a memory SLT tester. The system offers 1,680 DUT parallel testing and independent temperature control, covering the full flow from chip programming to system-level testing.

Skyverse Technology focuses on R&D of inspection and metrology equipment. A STAR Market-listed company and a leader in high-end semiconductor quality control equipment in China, it offers core products across nine series, including unpatterned wafer defect inspection, patterned wafer defect inspection, and 3D topography measurement. It showed a one-stop "optical, e-beam, and X-ray" inspection and metrology solution. Its core equipment has been adopted in batches on 28nm-and-above production lines at major memory makers, providing key support for China’s semiconductor quality control system.

Hongjingwei Technology focuses on R&D and sales of automated test and burn-in test equipment for high-end memory and modules. It offers one-stop testing and reliability validation solutions for phones, PCs, servers, and other scenarios, supporting mass-production testing and quality control. It showed the H-5E21A tester for LPDDR5X (496 balls, 256 DUT), the H-5525C tester for enterprise DDR5, and the Icarus Validator UFS validation system, covering burn-in and testing needs from R&D through volume production.

Tytantest, founded in 2023, focuses on memory and SoC testing, backed by a core team with 10+ years of test equipment R&D at leading semiconductor companies. Its product lineup covers ATE, burn-in testers, SLT testers, and SSD and DDR module test equipment. At the booth, Tytantest highlighted its TA8600/TA9600 ultra-high-speed ATE, the TL2900 SLT tester, and the TB7500 DRAM burn-in tester, supporting domestic test equipment coverage from CP/FT to module testing for DRAM and NAND Flash.

Conclusion

The GMIF2026 exhibition covered the memory value chain from memory IDMs and controllers to packaging/testing, equipment & materials, servers, automotive electronics, and AI applications. With 40 companies on show, it pointed to a shift in the value of memory, from raw capacity toward system performance, energy efficiency, and industry-wide innovation. GMIF will continue to work with partners across the chain to break through compute bottlenecks and build the storage foundation for the global AI era.

About GMIF

Global Memory Innovation Forum (GMIF) is a premier annual gathering that connects the global memory and storage community. Featuring diverse activities including keynote speeches, roundtable dialogues, supply-demand match-making, product showcases, industry rankings, awards programs, and global livestreaming, GMIF brings together key enterprises across the memory and storage chain, technical experts, terminal companies and investment institutions to exchange insights, build partnerships, and create business opportunities. Learn more about GMIF, please visit https://www.gmif.com.cn/. Follow us on LinkedIn, YouTube and Facebook.

Media Contact:

Carina Gu, wenjing.gu@gmif.com.cn

Source : GMIF2026 Exhibition Recap: Innovation Across the AI Memory & Storage Chain on Show

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